IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of SAC Alloy Composition on Drop and Temp cycle Reliability of BGA with NiAu Pad Finish

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): W. Kittidacha ; A. Kanjanavikat ; K. Vattananiyom
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,074 - 1,079
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763572
Regular:

The search for an optimized Sn/Ag/Cu (SAC) solder alloy with drop performance as good as SAC105 and temperature cycling (TC) performance as good as SAC305 is ongoing to reduce solder ball... View More

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