IEEE - Institute of Electrical and Electronics Engineers, Inc. - The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Weiping Liu ; P. Bachorik ; Ning-Cheng Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,046 - 1,053
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763568
Regular:

SAC-Ti alloys exhibited significantly improved drop test performance over not only SAC alloys, but also 63Sn37Pb for ENIG/OSP, NiAu/OSP, and OSP/OSP surface finish systems. The superior... View More

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