IEEE - Institute of Electrical and Electronics Engineers, Inc. - Package Design Optimization for Electrical Performance of a Power Module using Finite Element Analysis

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): I.V.A. Erwin ; Seung-Han Paek ; Taek-Keun Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 1,023 - 1,027
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763564
Regular:

This paper presents the development of a high power module package having improved its electrical performance optimizing the package structure and the circuit layout on a substrate throughout... View More

Advertisement