IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process Development for Realization of Embedded Structures in Multi-Layer Ceramics Platform using Carbon Fugitive Material

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Y.M. Tan ; L.E. Khoong ; Y.C. Lam ; S.C. Tan ; R. Paramasivam
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 982 - 987
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763557
Regular:

Fabrication of embedded structures in a multi-layer low co-fired ceramic (LTCC) substrate is essential in realizing multi-functional platform. One of the major fabrication challenges is to... View More

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