IEEE - Institute of Electrical and Electronics Engineers, Inc. - Stack Bonding Technique Using Heavy Aluminum Ribbon Wires

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): E.I.V. Almagro ; H.T. Granada
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 976 - 981
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763556
Regular:

The use of Aluminum ribbon wire is aimed to reduce the resistance of the interconnect material and improve product RDS(ON). Competition in the market in terms of low RDS(ON)... View More

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