IEEE - Institute of Electrical and Electronics Engineers, Inc. - Focused Heat Treatment after Bonding for Cu Wire Bond Reliability Improvement

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Y.K. Yun ; E.P. Leng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 965 - 970
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763554
Regular:

Currently, there is a great interest in applying copper material to wire bonding of fine pitch assembly packaging particularly to improve reliability through minimizing the deterioration of bonded... View More

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