IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Leong Ching Wai ; Xiaowu Zhang ; V. Kripesh ; C.S. Premachandran ; S.C. Chong ; Ying Ying Liu ; J. Madhukumar ; V.R. Srinivas ; P.P. Thaw ; M.J. Jong ; J.H. Lau ; S. Wang ; C.K. Foo ; M.L. Thew ; E.P.P. Myo ; W.L. Teo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 957 - 964
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763553
Regular:

Wire bonding is one of the common interconnection technologies being used in industry. Requirements for numbers of wires increased, bond pad pitch was reduced in order to maintain in small die... View More

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