IEEE - Institute of Electrical and Electronics Engineers, Inc. - Long Time Reliability of Cu Wire on Substrates with Al Based Metallisations

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): E. Milke ; T. Mueller
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 951 - 956
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763552
Regular:

The story of copper wire has existed for decades, and it always looked to be a very promising material. However, despite all of its positive properties copper bonding wire never managed to find... View More

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