IEEE - Institute of Electrical and Electronics Engineers, Inc. - Joint Scale Dependence of Aging Kinetics in Sn-Ag-Cu Solders

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): P. Kumar ; O. Cornejo ; I. Dutta ; G. Subbarayan ; V. Gupta
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 903 - 909
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763545
Regular:

Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during storage or service, resulting in evolution of joint properties, and hence reliability, over time. Although... View More

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