IEEE - Institute of Electrical and Electronics Engineers, Inc. - Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Fengqun Lang ; Y. Hayashi ; H. Nakagawa ; M. Aoyagi ; H. Ohashi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 897 - 902
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763544
Regular:

The tendency of high efficiency and high power density of power inverters needs three-dimensional (3-D) packaging techniques for power module packaging. In a 3-D power device packaging, it is... View More

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