IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast-Cure Lid Adhesive Development for Microprocessors

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Kee-Hean Keok ; S. Too ; J. Diep ; Quah Hong Tat ; A. Fumihiro ; Kim Le
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 885 - 889
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763542
Regular:

A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection... View More

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