IEEE - Institute of Electrical and Electronics Engineers, Inc. - Patterned Metallic Nanowire Arrays Based Flip Chip Interconnects

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): G. Sharma ; K. Vaidyanathan ; J.H. Lau
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 879 - 884
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763541
Regular:

Chip to substrate interconnect density is continuously being scaled down to support the rapidly decreasing minimum feature size of IC components. At very fine interconnect pitches not many chip to... View More

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