IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interface Characterization and Failure Modeling for Semiconductor Packages

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): L.J. Ernst ; A. Xiao ; B. Wunderle ; K. Jansen ; H. Pape
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 808 - 815
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763531
Regular:

Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate... View More

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