IEEE - Institute of Electrical and Electronics Engineers, Inc. - Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): M.A. Bahi ; P. Lecuyer ; A. Gentil ; H. Fremont ; J.-P. Landesman ; F. Christien
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 800 - 807
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763530
Regular:

To extend the qualification domain to the biggest package size in the automotive environment at high temperature, it is necessary to improve the Au-Al bond reliability. Thus, the improvement... View More

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