IEEE - Institute of Electrical and Electronics Engineers, Inc. - Studies on the Thermal Cycling Reliability of Fine Pitch Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates: Experimental Results and Numerical Analysis

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Ho-Young Son ; Kyung-Wook Paik ; Ilho Kim ; Jin-Hyoung Park ; Soon-Bok Lee ; Gi-Jo Jung ; Byung-Jin Park ; Kwang-Yoo Byun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 716 - 724
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763517
Regular:

A thick Cu column based double-bump flip-chip structure is one of the promising alternatives for fine pitch flip-chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg... View More

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