IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Zhou Bin ; Qiu Baojun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 704 - 708
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763515
Regular:

Voids in ball grid array (BGA) solder joints have been considered as a main problem in lead-free soldering process. Compared with tin-lead solder, worse wetting capability of lead-free solder... View More

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