IEEE - Institute of Electrical and Electronics Engineers, Inc. - Finite Element Based Solder Joint Fatigue Life Predictions for MLPQ Packages

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Y.S. Ng ; S.K. Chin ; Rosazlan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 696 - 703
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763514
Regular:

The solder joint fatigue life of flip chips and ball grid array packages has been extensively studied and published. However, there are only a few published papers available on the solder joint... View More

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