IEEE - Institute of Electrical and Electronics Engineers, Inc. - A New Creep Model for SnAgCu Lead-Free Composite Solders: Incorporating Back Stress

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Y.D. Han ; H.Y. Jing ; S.M.L. Nai ; C.M. Tan ; J. Wei ; L.Y. Xu ; S.R. Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 689 - 695
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763513
Regular:

The paper presents improved constitutive models for SnAgCu solder. In the present study, the constitutive behavior for creep performance of 95.8Sn-3.5Ag-0.7Cu lead-free solder was investigated.... View More

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