IEEE - Institute of Electrical and Electronics Engineers, Inc. - Calibrate MOSFET Micro-Stress Sensors for Electronic Packaging

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Hsien Chung ; Chun-Pai Tang ; Yung-Ching Chao ; Kun-Fu Tseng ; Ben-Je Lwo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 650 - 656
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763507
Regular:

Stress measurements in microelectronic packaging through the MOSFET devices have attracted great attentions because the measurement is in-situ and nondestructive. In this study, a new assembled... View More

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