IEEE - Institute of Electrical and Electronics Engineers, Inc. - Inspection of Miniaturised Interconnections in IC Packages with Nanofocus ® X-Ray Tubes and NanoCT

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): H. Roth ; Z. He ; T. Paul
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 644 - 649
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763506
Regular:

Nanofocus tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus... View More

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