IEEE - Institute of Electrical and Electronics Engineers, Inc. - A New process for Flip-chip Interconnections with Variable Stand-offs

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): O.S. Kessling ; F. Schussler ; K. Feldmann ; T.C. Lueth
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 620 - 625
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763502
Regular:

This paper presents a new process to improve the reliability of solder connections of miniaturized flip-chips by creating a variable stand-off using jetting technology. This technology is used to... View More

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