IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fluxless Flip-Chip Bonding Process Using Hydrogen Radical

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): T. Hagihara ; T. Takeuchi ; Y. Ohno
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 595 - 600
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763498
Regular:

Recently the portable electronic appliances have been remarkably minimized- (in weight and thickness), the assembled electric parts have also been gotten smaller and 3- dimensional and Flip-Chip... View More

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