IEEE - Institute of Electrical and Electronics Engineers, Inc. - Determination of Mechanical Material Properties of Joining Materials, in particular Microelectronic Solders

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): W.H. Muller ; H. Worrack ; J. Sterthaus ; J. Wilden ; J. Villain
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 575 - 581
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763495
Regular:

During fabrication of modem microelectronic components miscellaneous solder materials are used. In order to ensure high quality of the manufacturing process as well as optimal reliability of the... View More

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