IEEE - Institute of Electrical and Electronics Engineers, Inc. - An Investigation Concerning the Diffusion Of Elements in Sn-Ag3.8-Cu0.7 and Sn-Pb36-Ag2 on Electrolytic Ni-Au Pads during Pre-Pack Thermal Aging

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): R. Vemal ; M. Hamdi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 565 - 570
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763493
Regular:

Much literature has been written and debated on the effects of reflow profiles on IMC {Inter-metallic compound) formation for solder alloys and the diffusion of elements during this process. This... View More

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