IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optimization of the Thermal Performance of Microchannel Heat Sinks Using Thermally Developing Nusselt Number Correlation

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): P.S. Lee ; S.K. Chou ; Y.J. Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 545 - 551
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763490
Regular:

One-dimensional (1-D) thermal resistance model has been shown in various works to be a computationally economical alternative to the full three-dimensional (3-D) conjugate heat transfer analysis... View More

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