IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of Thermal Performance of High Power Light Emitting Diodes Package

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Wei-Hao Chi ; Tsung-Lin Chou ; Cheng-Nan Han ; Kuo-Ning Chiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 533 - 538
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763488
Regular:

This paper reports on the thermal characteristics of the high power LED package. The increment of input power generates more heat in the chip, decreasing the luminance and life span of LEDs. To... View More

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