IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): C. Bailey
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 527 - 532
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763487
Regular:

Extracting heat from electronic systems has always been a challenging task for electronic package designers. Ever increasing miniaturisation and functionality of Microsystems packaging... View More

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