IEEE - Institute of Electrical and Electronics Engineers, Inc. - Creep Properties of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) Lead-Free Solder

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Kok Ee Tan ; Xu Luhua ; J.H.L. Pang ; J.H. Lau ; X.W. Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 521 - 526
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763486
Regular:

Lead free solders with Sn-Ag-Cu (SAC) alloy compositions are now widely used in the electronics industry. Further enhancement of SAC solders by small addition of a forth element is aimed to... View More

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