IEEE - Institute of Electrical and Electronics Engineers, Inc. - In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): D. Herkommer ; M. Reid ; J. Punch
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 506 - 515
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763484
Regular:

In this paper the creep behaviour of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs have... View More

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