IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Stand-Off Height on Microstructure and Tensile Strength of Cu/Sn9Zn/Cu Solder Joint

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Fengshun Wu ; Bo Wang ; Bin Du ; Bing An ; Yiping Wu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 494 - 498
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763482
Regular:

To investigate the effect of the stand-off height (SOH) on the microstructure and mechanical behavior of certain solder joints, Cu/Sn9Zn/Cu solder joints with SOH of 100¿m, 50¿m 20¿m and 10¿ were... View More

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