IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Eu Poh Leng ; Wong Tzu Ling ; N. Amin ; I. Ahmad
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 463 - 469
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763477
Regular:

A study was conducted to assess the backward compatibility of three different lead-free BGA components using Jedec Solderability testing method (JESD22-B102D). The test was conducted at component... View More

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