IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal and Hydraulic Design and Characterization of a Liquid-Cooled 3D Silicon Module

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): S.P. Tan ; K.C. Toh ; N. Khan ; Tang Gong Yue ; P. Damaruganath ; K. Vaidyanathan ; J.H. Lau
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 350 - 354
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763459
Regular:

Thermal management in 3D packaging is a critical factor to be considered in enabling this technology to be exploited further. Heat density in excess of 100 W/cm2 can be achieved due to... View More

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