IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mechanical Performance of Polymer Cored BGA Interconnects

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): F.G. Marin ; D. Whalley ; H. Kristiansen ; Z. Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 316 - 321
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763454
Regular:

This paper presents the results from preliminary models comparing the mechanical performance of polymer cored BGA type interconnects with conventional solid solder BGA balls. The surface evolver... View More

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