IEEE - Institute of Electrical and Electronics Engineers, Inc. - Embedded Leadless Chip Carrier

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): L.A. Lim ; M. Ramkumar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 249 - 253
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763442
Regular:

Recently there have been several developments in the areas of small form factor and high-density lead frame based IC packages. These packages have the benefits of occupying smaller PC board area,... View More

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