IEEE - Institute of Electrical and Electronics Engineers, Inc. - A new Embedded Packaging Technology for high power LEDs

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): M. de Samber ; T. v. d. Ackerveken ; M. Burghoom ; N. Bruinsma ; E. van Grunsven
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 242 - 248
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763441
Regular:

A new wafer level packaging concept for a multi-color Light Emitting Diode (LED) lighting device is suggested and demonstrated. The concept tackles 2 major challenges in high power LED packaging:... View More

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