IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of Die Embedded Substrate and Mechanical Stress Evaluation at Active Area of the Embedded Die

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Doohwan Lee ; Seunggu Kim ; Moonil Kim ; Onecheol Bae ; Kwankyu Kim ; Hoshik Kang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 224 - 229
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763438
Regular:

Measurement and modeling for the stress on the active area of the die embedded in an organic resin system has been studied. Embedded structure was successfully realized by doing a sequential... View More

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