IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced Metallization for 3D Integration

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): R. Beica ; P. Siblerud ; C. Sharbono ; M. Bernt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 212 - 218
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763436
Regular:

Increasing demand for new and more advanced electronic products, with smaller form factor and superior functionality and performance, while reducing the cost, has driven the semiconductor industry... View More

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