IEEE - Institute of Electrical and Electronics Engineers, Inc. - Managing Losses in Through Silicon Vias with Different Return Current Path Configurations

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): B. Curran ; I. Ndip ; S. Guttovski ; H. Reichl
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 206 - 211
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763435
Regular:

The high bulk conductivity of silicon, leading to high attenuation, will become a significant challenge for designers of silicon-based system-in-package modules. In this paper, losses in TSV... View More

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