IEEE - Institute of Electrical and Electronics Engineers, Inc. - Laser Assisted Solder Bump Mold Fabrication

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Yong-Jin Lim ; Seoung-Ho Jung ; S.-i. Park ; Jung-Su Choi ; Eun-Youl Choi ; Chung-Tae Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 181 - 185
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763431
Regular:

Sold bump mold fabrication using Excimer laser (KrF, 248 nm) source for patterning method is presented. The mold is designed to make reflowed solder bump with diameter of 115 ¿m for 8 inch wafer.... View More

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