IEEE - Institute of Electrical and Electronics Engineers, Inc. - Plastic Packaging Using Low Frequency Induction Heating (LFIH) For Microsystems

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): B.J. Knauf ; D.P. Webb ; C. Liu ; P.P. Conway
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 172 - 180
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763430
Regular:

Microfluidic systems are being used in more and more areas and the demand for such systems is growing every day. Hence, a cheap and rapid method for sealing these microfluidic platforms which can... View More

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