IEEE - Institute of Electrical and Electronics Engineers, Inc. - Stepped Die Packaging

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Chua Swee Kwang ; Neo Yong Loo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 167 - 171
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763429
Regular:

With the increase in memory needed by consumer, higher capacity memory is in greater demand. But before the next higher density memory die is available, memory chips are normally stacked to... View More

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