IEEE - Institute of Electrical and Electronics Engineers, Inc. - Recent Development of Nano-solder Paste for Electronics Interconnect Applications

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): J. Liu ; C. Andersson ; Yulai Gao ; Qijie Zhai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 84 - 93
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763416
Regular:

Conventional lead-free solders, with a solder alloy particle size in the micrometer range, present some major disadvantages, such as relatively high melting temperatures, which can result in... View More

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