IEEE - Institute of Electrical and Electronics Engineers, Inc. - Glass as a Substrate for High Density Electrical Interconnect

2008 10th Electronics Packaging Technology Conference (EPTC 2008)

Author(s): Xiaoyun Cui ; D. Bhatt ; F. Khoshnaw ; D.A. Hutt ; P.P. Conway
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Singapore, Singapore
Conference Date: 9 December 2008
Page(s): 12 - 17
ISBN (CD): 978-1-4244-2118-3
ISBN (Paper): 978-1-4244-2117-6
DOI: 10.1109/EPTC.2008.4763405
Regular:

The high volume production of substrates able to support high density interconnection is becoming increasingly difficult as the pitch of devices continues to decrease. An important issue is the... View More

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