IEEE - Institute of Electrical and Electronics Engineers, Inc. - Methodology for thermal aware physical design

TENCON 2008 - 2008 IEEE Region 10 Conference

Author(s): V.P. Kalangi ; M.A. Kumar ; P. Agrawal ; R.S.T. Srinivasa ; A. Pal
Sponsor(s): IEEE Region 10
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Hyderabad, India
Conference Date: 19 November 2008
Page(s): 1 - 4
ISBN (CD): 978-1-4244-2409-2
ISBN (Paper): 978-1-4244-2408-5
ISSN (Electronic): 2159-3450
ISSN (Paper): 2159-3442
DOI: 10.1109/TENCON.2008.4766714
Regular:

Exponentially increasing power densities in current day designs due to aggressive technology scaling has resulted in temperature being one of the primary design constraint along with others like... View More

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