IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D inspection of electronic devices by means of stereo method on single camera environment

IECON 2008 - 34th Annual Conference of IEEE Industrial Electronics Society

Author(s): A. Kusano ; T. Watanabe ; T. Funahashi ; T. Fujiwara ; H. Koshimizu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Orlando, FL, USA
Conference Date: 10 November 2008
Page(s): 3,391 - 3,396
ISBN (CD): 978-1-4244-1766-7
ISBN (Paper): 978-1-4244-1767-4
ISSN (Paper): 1553-572X
DOI: 10.1109/IECON.2008.4758505
Regular:

It is very important to guarantee the quality of the industrial products by means of visual inspection. In order to reduce the soldering defect with terminal deformation and terminal burr in the... View More

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