IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of defects reduction and pattern abnormal on semiconductor Copper Dual Damascene process

2008 IEEE International Conference on Electron Devices and Solid-State Circuits

Author(s): Chun-Jen Weng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2008
Conference Location: Hong Kong, China
Conference Date: 8 December 2008
Page(s): 1 - 4
ISBN (CD): 978-1-4244-2540-2
ISBN (Paper): 978-1-4244-2539-6
DOI: 10.1109/EDSSC.2008.4760632
Regular:

Process manufacturing defects can often impact product yields, depending upon the type, size, and location of the defect, as well as the design and yield sensitivity of the respective... View More

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