IEEE - Institute of Electrical and Electronics Engineers, Inc. - Edge characterization of 3d silicon sensors after bump-bonding with the ATLAS pixel readout chip

2008 IEEE Nuclear Science Symposium and Medical Imaging conference (2008 NSS/MIC)

Author(s): Ole Myren Rohne
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2008
Conference Location: Dresden, Germany, Germany
Conference Date: 19 October 2008
Page(s): 1,929 - 1,934
ISBN (CD): 978-1-4244-2715-4
ISBN (Paper): 978-1-4244-2714-7
ISSN (Paper): 1095-7863
DOI: 10.1109/NSSMIC.2008.4774766
Regular:

3D silicon sensors with electrodes penetrating the full substrate thickness, different electrode configurations and with active edges, where bump-bonded to the ATLAS pixel readout chip FE-I3 in... View More

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