IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of High Hardness Micro Mold Using Double Layer Nickel Electroforming

2008 International Symposium on Micro-NanoMechatronics and Human Science

Author(s): Y. Sawa ; K. Yamashita ; T. Kitadani ; D. Noda ; T. Hattori
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Nagoya, Japan
Conference Date: 6 November 2008
Page(s): 402 - 407
ISBN (CD): 978-1-4244-2919-6
ISBN (Paper): 978-1-4244-2918-9
DOI: 10.1109/MHS.2008.4752486
Regular:

The LIGA is a total process for fabricating the metal mold of microstructure using deep X-ray lithography, electroforming a micro metal mold, and precise molding. This advantage is that it could... View More

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