IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cells adhesion/detachment control onto temperature-responsive glass coverslips modified with ultra thin poly(N-isopropylacrylamide) layer and its application of cell detachment process observed by TIRF microscopy

2008 International Symposium on Micro-NanoMechatronics and Human Science

Author(s): Y. Akiyama ; K. Fukumori ; M. Yamato ; K. Sakai ; T. Okano
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Nagoya, Japan
Conference Date: 6 November 2008
Page(s): 381 - 386
ISBN (CD): 978-1-4244-2919-6
ISBN (Paper): 978-1-4244-2918-9
DOI: 10.1109/MHS.2008.4752482
Regular:

Poly(N-isopropylacrylamide) (PIPAAm) was covalently grafted on glass coverslips (PIPAAm-CSs) by electron beam irradiation. Thickness and amount of the grafted polymer amount were increased... View More

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