IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching

2008 International Symposium on Micro-NanoMechatronics and Human Science

Author(s): P. Pal ; K. Sato
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2008
Conference Location: Nagoya, Japan
Conference Date: 6 November 2008
Page(s): 12 - 16
ISBN (CD): 978-1-4244-2919-6
ISBN (Paper): 978-1-4244-2918-9
DOI: 10.1109/MHS.2008.4752414
Regular:

The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities. The process is developed using direct... View More

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